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Musk is going to melt the Statue of Liberty? Musk also responded to the rumors of foreign media. Recently, a screenshot appeared on the American network. The content was that CNN published a report saying that Musk, a well-known American entrepreneur, was going to melt the Statue of Liberty in the United States to make a limited edition electric pickup truck. However, Reuters later denied that the CNN report was forged. A spokesman for CNN also told Reuters that the CNN report in the screenshot was forged, and CNN had never published such a report. At present, Musk himself has responded to this matter in a teasing tone on his social platform X. Musk wrote in three posts: "No, I will melt it 1000% (Statue of Liberty)"; "With a laser eye from space"; "and then cast it again before no one notices";Afternoon comments on Hong Kong stocks: Hang Seng Index rose by 1.72%, Hang Seng Technology Index rose by 2.55%, Hong Kong stocks closed at noon, Hang Seng Index rose by 1.72% and Hang Seng Technology Index rose by 2.55%. Chinese brokerage stocks and consumer stocks were among the top gainers, with China Merchants Securities, Mengniu Dairy and Tongcheng Travel up over 7% and over 5% respectively.Shanghai Minhang issued 50 opinions to promote high-quality industrial development and strengthen high-quality financial empowerment. The Minhang District People's Government of Shanghai issued the Policy Opinions on High-quality Industrial Development in Minhang District (Trial) on December 12, aiming at improving the basic industrial capacity and the modernization level of industrial chain, accelerating the concentration of various advanced production factors to the development of new-quality productive forces, and promoting the high-quality industrial development in Minhang District. The opinion proposes to strengthen the empowerment of high-quality finance, form a 30 billion yuan "special loan for high-quality development of enterprises in Minhang District", give preferential interest rates to loans, and give subsidies according to a certain proportion of loan interest. Form a credit line of 20 billion yuan "Minhang District Special Loan for Supporting New Infrastructure Construction" to give gradient support to various fixed assets projects.

The main contract of CSI 500 stock index futures (IC) expanded to 1.00% in the day and is now reported at 6104.4 points. The main contract of CSI 500 stock index futures (IC) stood at 6100 points, rising by 0.99% in the day.Mizuho listed in Japan to invest in the ETF of Saudi stock market.The daily limit of Sanyuan shares and Panda dairy products rose due to changes in the dairy sector, while Sanyuan shares and Panda dairy products rose due to changes in the dairy sector. The western animal husbandry industry rose by over 15%, followed by Ligao food, qiaqia food and Nanqiao food.

Thailand's consumer confidence index rose to 56.9 in November, boosted by stimulus measures, and Thailand's consumer confidence index rose from 56.0 to 56.9 in November.An earthquake of magnitude 4.0 occurred in the waters near the Fukushima Daiichi nuclear power plant in Japan. According to Japanese media reports, an earthquake of magnitude 4.0 occurred on the morning of the 12th local time in the eastern coastal area of Fukushima Prefecture, Japan, with a focal depth of 50 kilometers. Fukushima Prefecture has a sense of earthquake in many places, including Urachi-CHO, Langjiang-CHO and Yuye-CHO, among which Urachi is the location of Units 1 to 4 of the Fukushima Daiichi nuclear power plant. (CCTV News)Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)